description[de] = Multi-CB EAGLE Design Rules für 2 Lagen Dick-Kupfer (70µm)\n
\n200µm Leiter, 0.2mm Drill, ca. 70µm End-Kupfer (35µm Startkupfer)\n\nBitte beachten:\n
\n - Vias kleiner/gleich 0.45mm werden mit Lötstopp abgedeckt. Eine Freistellung der Vias kann unter Masks/Limit gesetzt werden.
\n - Bitte nur Vektorschrift verwenden! Im Control-Panel unter Optionen/Benutzeroberfläche: Immer Vektor-Schrift.
\n - Langlöcher im Layer 46 werden als durchkontaktierte Schlitze (DK) gefertigt, falls von Kupfer umgeben. NDK-Langlöcher müssen im Layer 20 definiert sein (Preisvorteil).
\n - Dieses .dru-File ist für Boards mit Fräskontur. Geritzte Kontur erfordert Distance/Copper/Dimension: 0.5mm.
\n - Falls Lötstopp-Brücken im gleichen Netz erwünscht: Clearance/Same Signals anpassen (empfohlen: 8mil)
\n - Supply/ Generate thermals ist standardmäßig aktiviert; kann auch deaktiviert werden.
\n - Zum Reduzieren der Pad-Größe für SMD-Schablonen kann Masks/Cream angepasst werden.
\n
\nWeitere Hinweise finden Sie unter Design-Hilfe auf unserer Webseite www.multi-cb.de.\n\n\nIhr Multi-CB Team\n
\nAlle Angaben ohne Gewähr! Eine perfekte Einstellung der Design-Rules kann verständlicherweise nur durch den Anwender erfolgen.\n
description[en] = Multi-CB EAGLE Design Rules for 2 layers thick-copper (70µm)\n
\n200µm tracks, 0.2mm drills, ca. 70µm final copper (35µm start copper)\n\nPlease note:\n
\n - Vias less/equal 0.45mm will be covered with solder mask. An exemption of the vias can be placed under Masks / Limit.
\n - Please only use vector fonts! In Control Panel under Options / User Interface: Always vector font.
\n - Oblong holes in the layer 46 are manufactured as plated-through slots (PTH), if surrounded by copper. NPTH-slots must be defined in the layer 20 (price advantage).
\n - This .dru-File is for boards with milling contour. V-scoring contour requires Distance / Copper / Dimension: 0.5mm.
\n - If solder-stop bridges on the same network are desired: Adjust Clearance / Same signal (recommended 8mil)
\n - Supply / Generate thermals is enabled by default; can also be deactivated.
\n - To reduce the pad size for SMD-Stencils: Masks/Cream can be customized.
\n
\nFor more information, see Design-Aid on our website www.multi-cb.de.\n\n\nYour Multi-CB Team\n
\nAll statements without guarantee! A perfect setting of design rules can understandably only be performed by the user.\n
layerSetup = (1*16)
mtCopper = 0.035mm 0.07mm 0.07mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
mtIsolate = 1.55mm 0.71mm 0.36mm 0.2mm 0.2mm 0.2mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
mdWireWire = 0.2mm
mdWirePad = 0.2mm
mdWireVia = 0.2mm
mdPadPad = 0.2mm
mdPadVia = 0.2mm
mdViaVia = 0.2mm
mdSmdPad = 0mil
mdSmdVia = 0mil
mdSmdSmd = 0mil
mdViaViaSameLayer = 0.2mm
mnLayersViaInSmd = 2
mdCopperDimension = 0.2mm
mdDrill = 0.2mm
mdSmdStop = 0mil
msWidth = 0.2mm
msDrill = 0.2mm
msMicroVia = 0.1mm
msBlindViaRatio = 1.000000
rvPadTop = 0.250000
rvPadInner = 0.250000
rvPadBottom = 0.250000
rvViaOuter = 0.250000
rvViaInner = 0.250000
rvMicroViaOuter = 0.000000
rvMicroViaInner = 0.000000
rlMinPadTop = 0.2mm
rlMaxPadTop = 0.5mm
rlMinPadInner = 0.2mm
rlMaxPadInner = 0.5mm
rlMinPadBottom = 0.2mm
rlMaxPadBottom = 0.5mm
rlMinViaOuter = 0.2mm
rlMaxViaOuter = 0.5mm
rlMinViaInner = 0.2mm
rlMaxViaInner = 0.5mm
rlMinMicroViaOuter = 0.2mm
rlMaxMicroViaOuter = 0.5mm
rlMinMicroViaInner = 0.2mm
rlMaxMicroViaInner = 0.5mm
psTop = -1
psBottom = -1
psFirst = -1
psElongationLong = 100
psElongationOffset = 100
mvStopFrame = 1.000000
mvCreamFrame = 0.000000
mlMinStopFrame = 2mil
mlMaxStopFrame = 2mil
mlMinCreamFrame = 0mil
mlMaxCreamFrame = 0mil
mlViaStopLimit = 0.45mm
srRoundness = 0.000000
srMinRoundness = 0mil
srMaxRoundness = 0mil
slThermalIsolate = 0.2mm
slThermalsForVias = 1
dpMaxLengthDifference = 10mm
dpGapFactor = 2.500000
checkGrid = 0
checkAngle = 0
checkFont = 1
checkRestrict = 1
useDiameter = 13
maxErrors = 50